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ISSN  :   1065-0555 ( Print )   Inactive

Advanced Packaging

Aim & Scope
Advanced Packaging, published monthly, is the key source for information for engineers involved in microelectronics packaging materials and technologies, and provides the global perspective necessary for the IC packaging industry. [1]

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Continuations
(  N.A.  -  N.A.  ) Hybrid Circuit Technology    (  1992  -  2009  ) Advanced Packaging
Issues

No issues currently indexed for this periodical.